High-Precision Chip Package Strain Testing with Excellent Repeatability
Customer: Samsung

Industry: Semiconductor & Electronics Manufacturing
Application: Chip Strain Testing
Equipment: KRD11-15A High-Cycling Shock Test System

Challenge
As electronic products continue to evolve toward higher integration, miniaturization, and enhanced reliability, strain and stress experienced by semiconductor packages during transportation, drop events, and mechanical shocks have become critical concerns.
Excessive mechanical strain can lead to solder joint cracking, package failure, or degraded chip performance. Therefore, precise strain testing is essential during product development and reliability validation.
Samsung required repeated testing at different strain levels to verify both system stability and result consistency.
Key challenges included:
Solution
To meet Samsung’s testing requirements, CME supplied the KRD11-15A High-Cycling Shock Test System.
The system generates precise and repeatable shock pulses through a motor drive mechanism, providing a reliable platform for chip package strain testing and electronic product reliability validation.
To satisfy Samsung’s high-strain testing requirements, CME optimized the KRD11-15A structure by incorporating an Elastic String-assisted design. This enhancement improves the dynamic response characteristics of the system and enables stable generation of higher strain levels required for semiconductor package reliability testing.
Solution Advantages
High-Precision Strain Testing Capability
The system provides precise shock control to meet the stringent requirements of semiconductor package strain testing.
Elastic String-Assisted Design
To satisfy Samsung’s chip package strain testing requirements, an Elastic String-assisted structure was integrated into the system. This design improves dynamic response performance and enables stable achievement of strain levels up to 3000 µε, 3300 µε, and 3600 µε while maintaining excellent repeatability.
Excellent Repeatability
Through optimized mechanical design and proven control technology, the system delivers highly consistent and repeatable test results.
Multiple Strain Level Capability
Supports various target strain levels for product development and reliability validation.
Efficient Testing Platform
Fast setup and easy parameter adjustment enable efficient validation under different testing conditions.
Suitable for Electronic Reliability Testing
Widely applicable to semiconductor packages, PCB assemblies, electronic modules, and consumer electronics reliability testing.
Fully Enclosed Safety Protection Design
The system is equipped with transparent polycarbonate safety guarding on all four sides, creating a fully enclosed test area. All four access doors can be opened independently, providing convenient access for specimen installation, fixture adjustment, and routine maintenance while ensuring operator safety.
Three-Color Tower Light Indication
A three-color tower light is integrated into the system to provide clear visual indication of equipment status. Different light colors indicate standby, operation, and alarm conditions, improving operational visibility and enhancing workplace safety.
Test Validation Results
During factory acceptance testing, the KRD11-15A successfully completed multiple strain-level validation tests, including:
Target Strain Levels
With the optimized mechanical structure and Elastic String-assisted design, the system consistently achieved the target strain levels. Repeated testing demonstrated excellent repeatability and stability.

Fixture
Results
By implementing the KRD11-15A High-Cycling Shock Test System, Samsung successfully established a high-precision chip strain testing capability.
Accurate Strain Control
Successfully achieved stable strain levels of 3000 µε, 3300 µε, and 3600 µε.
Reliable Test Results
Repeated testing demonstrated excellent consistency, providing reliable data for semiconductor reliability validation.
Enhanced Product Optimization
Provided valuable data for evaluating semiconductor package performance and optimizing product design.
Support for High-Reliability Testing
Delivered a dependable mechanical shock testing solution for semiconductor and electronics applications.
By adopting the CME KRD11-15A High-Cycling Shock Test System, Samsung successfully completed chip strain and stress validation testing. The system consistently achieved strain levels of 3000 µε, 3300 µε, and 3600 µε with excellent repeatability, providing reliable data support for semiconductor reliability validation and product optimization.
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